Services

Within our group, we offer the following paid services:

Materials: - Semiconductors Si, Ge, GaAs, mainly II-VI compounds (CdTe, CdZnTe, InP), Halide perovskites, ferrites, metals, glasses, as well as many other solids

Crystal cutting

• Oriented cutting
• Fine cutting of a large-volume crystals (up to 5 inches diameter)

Wire Saws:

• Diamond wire-saw WELL6234, wire dia. 500μm
• Diamond wire-saw WELL3242, wire dia. 300μm (http://www.welldiamondwiresaws.com/)
• Stainles-steel abrasive wire-saw SBT 850, wire dia. 0.05’’, 0.10’’, 0.15’’ with glycerine abrasive slurry (http://www.southbaytech.com/shop/850.shtml)
• Precision wire-saw WS 22 with a thin tungsten (molybdenum) wire, moistened with an oil- or glycerin suspended abrasive slurry, wire dia. 0.05’’

Mechanical and Chemical polishing - Logitech polishing setup

Etching

• Etching in acids and bases
• Special etching in bromine-methanol, bromine-ethylene glycol, DMSO, DMF solutions

Resistivity 2D Maping (contactless resistivity COREMA)

Photoluminescence 2D Maping

Surface roughness 2D Maping - ZYGO interferometer, 2D maps, profiles - wafers (plan samples) up to 10 cm in diameter

Semiconductor Radiation Detectors Testing

• Pockels effekt analysis - 2D maping if internal electric field profiles in detectors
• Laser-induced Transient current technique - determination of transport properties of radiation detectors (mobility, lifetime, internal electric field profile, space charge density etc)

Interest or questions? Contact us!