Publikace v časopisech

1.

H. Elhadidy, "Electromigration and polarization in Schottky Contacts CdTe Based Compounds", Arab Journal of Nuclear Sciences and Applications 52 (2019) 13-18.

2.

H. Elhadidy, F. Mahi, J. Franc, A. Musiienko, V. Dědič, O. Schneeweiss, "Calculation of High-Frequency noise spectral density of different CdTe metal-semiconductor-metal Schottky contacts", Journal of Electronic Materials 48 (2019) 7806-7812.

3.

H. Elhadidy, F. Mahi, J. Franc, A. Musiienko, V. Dědič, O. Schneeweiss, "High frequency noise calculation in Schottky metal-semiconductor-metal structure and parameter retrieval of nanometric CdTe structure", Thin Solid Films 645 (2018) 340-344.

4.

H. Elhadidy, J. Franc, V. Dědič, A. Musiienko, "Transient phenomena at Schottky Au-CdZnTe", J. Instrumentation 13 (2018) C10001 (11 pages).

5.

H. Elhadidy, R. Grill, J. Franc, P. Moravec, A. Musiienko, V. Dědič, G. Korcsmáros, O. Schneeweiss, "Study of electromigration phenomena in Au/p-type CdTe with two Schottky contacts", J. Instrumentation 13 (2018) C10002 (9 pages).

6.

H. Elhadidy, R. Grill, J. Franc, O. Šik, P. Moravec, O. Schneeweiss, "Ion electromigration in CdTe Schottky metal–semiconductor–metal structure", Solid State Ionics 278 (2015) 20-25.

7.

H. Elhadidy, V. Dědič, J. Franc, "Study of polarization phenomena in n-type CdZnTe", J.Phys.D - Appl.Phys. 47 (2014) 055104 (5 pages).

8.

H. Elhadidy, J. Šikula, J. Franc, "Symetrical current-voltage characteristic of a metal-semiconductor-metal structure of Schottky contacts and parameter retrieval of a CdTe structure", Semicond. Sci. Technol. 27 (2012) 015006.

9.

H. Elhadidy, J. Franc, E. Belas, P. Hlídek, P. Moravec, R. Grill, P. Höschl, "Thermoelectric Effect Spectroscopy and Photoluminescence of High-Resistivity CdTe:In", J. Electron. Mater. 37 (2008) 1219-1224.

10.

H. Elhadidy, J. Franc, P. Moravec, P. Höschl, M. Fiederle, "Deep level defects in CdTe materials studied by thermoelectric effect spectroscopy and photo-induced current transient spectroscopy ", Semicond. Sci. Technol. 22 (2007) 537-542.